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Structured ASIC Family
CX6100 with multi-lane PCIe PHY

CX6200 with USB 2.0 PHY
A3988 quad full-bridge motor driver

     
     
ChipX Structured ASIC combines proven PCI Express and USB solutions with full custom silicon and fast time to market.
     

ChipX Structured ASIC FamilyThe CX6100 and CX6200 product families, members of the latest generation of Structured ASICs from ChipX, combine built-in, silicon-proven, industry standard PHYs for PCI Express or USB 2.0 High Speed On-the-Go (OTG) with the well-proven X-Cell™ Structured ASIC architecture to provide industry leading performance using the UMC 130nm High Speed process. Up to four metal layers are used for customization, allowing ChipX to hold wafers at bank with most of the processing completed. Prototypes are manufactured, assembled, tested and shipped in just 4 to 5 weeks.

The built-in, silicon-proven PCI Express PHY or USB 2.0 HS OTG PHY, in combination with ChipX validated PCIe/USB controllers, form a complete, interoperability-proven, subsystem capable of achieving PCI-SIG or USB-IF compliance. You can also use your own controller where desired. ChipX offer 32-bit BA12 and 8-bit 8051 synthesizable processors to ease system integration.The subsystem on the CX6100 and CX6200 families of products removes complexity and risk of IP selection and IP interoperability testing, enabling faster time to market.

     
A3988 quad full-bridge motor driver
 
     
PCI Express PHY offers up to 8 lanes at 2.5Gbps
USB 2.0 HS On-the-Go PHY offers OTG, Device and Host functionality
True ASIC gate count of 140K to 1.8M usable gates, custom configurations also available
High-speed embedded SRAM of 233Kb to 1.1Mb
Granular X-Cell™ Structured ASIC architecture for maximum routability and density
Highly configurable RAM blocks of 9Kb for excellent memory use efficiency
Single port, dual port or FIFO configurations of RAM blocks
One-time Programmable memory available on some devices
Core operating voltage 1.2V
I/O voltages of 1.5V, 1.8V, 2.5V and 3.3V
Output drive strengths of up to 16mA
Flexible I/O pads that can be power, ground, input, output or bi-directional
I/Os: LVTTL, LVCMOS, HSTL (1/2/3), SSTL (18/2/3), 840Mb/s LVDS, RSDS, PCI, PCI-X, XOSC
250MHz maximum global operating frequency
Up to seven PLLs with output frequency range of 10MHz - 1GHz
Multiple DLLs with output frequency of up to 500MHz
Commercial and Industrial grade temperature libraries
Packages from 56QFN to 896PBGA
   
 
Benefits
Widest range of Structured ASICs in the market
Unique ability to combine silicon tested, built-in PHY with controllers and processors of your choice
Low NRE, low-to-medium volume (10K/year to 500K/year) production
Very fast turn around time: from start to tested, packaged prototypes in 12 weeks or less.
Seamlessly convert from Structured ASIC to Standard Cell using XPath methodology from ChipX and obtain rebate toward Standard Cell NRE, making Structured ASIC NRE virtually free.
   
ChipX CX6100 and CX6200 families can be used in a wide variety of applications requiring high-speed connectivity including:
Industrial computing/control and factory automation
Single board computer
Medical equipment
Test, measurement and instrumentation
Printers, scanners and print management systems
Audio/Video console
Office automation
Broadcast systems
Advanced TCA platforms
Head-end equipment
Wireless base stations
Wired and wireless routers
Multi-service switches
Set-top boxes
Digital TVs
POS systems
   
     
 

Also Visit: Titan Supply Chain Services Corp. Nu Horizons International