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Home > Line Card > Product Change Notices > Osram
Product Change Notices
OS-PCN-2008-024-A - Introduction of new chip design and phosphor process for LW G6CP - October 1, 2008
OS-PCN-2008-006-A - Relocation of Backend Production within Industrial Area - August 6, 2008
OS-PCN-2008-002-A - Improvement of Color Rendering Index (CRI) & new chromaticity coordinate groups for certain "warm white" OSTAR products - March 7, 2008
OS-PCN-2008-003-A - Improvement of Color Rendering Index (CRI) & finer white binning for certain warm white products - March 3, 2008
OS-PCN-2008-004-A - Replacement of Ag-filled die attach glue - February 22, 2008
OS-PCN-2007-047-A - Transfer of product assembly to subcontractor in China, replacement of Ag filled die attach glue and change of wire bonding - for Metal Can products - January 3, 2008
OS-PCN-2007-039-A - Introduction of additional chip design for InGaN Aton Chip Technology - November 9, 2007
OS-PCN-2007-032-A - Consolidation of Power-ThinGaN Chip Design - October 9, 2007
OS-PCN-2007-005-A1 - Change of leadframe plating material from Au to Ag and die attach glue from Au-filled to Agfilled - September 26, 2007
OS-PCN-2007-031-A - Second Source for SFH 2701 assembly - July 30, 2007 (PDF - 38Kb) OS-PCN-2007-025-A - Capacity increase of SmartDIL-line - July 30, 2007
OS-PCN-2007-019-A - Introduction of diffuse silicone for white PowerTOPLED with ThinGaN Chip - June 18, 2007
OS-PCN-2007-024-A - Changes of PCB-design for orientation sensor SFH 7710 - June 4, 2007
OS-PCN-2007-016-A - Transfer of product assembly to subcon in China for products SFH 9500 and SFH 9315 - June 4, 2007
OS-PCN-2007-017-A - Ceramic Intelligent Display: yellow LED chip Change - May 21, 2007
OS-PCN-2007-008-A - Second Source for Silicon PIN Photodiode Chip F302 - May 14, 2007
OS-PCN-2007-005-A1 - Change of leadframe plating material from Au to Ag and die attach glue from Au-filled to Agfilled - April 19, 2007
OS-PCN-2006-019-B - Change of single-emitter high-power-laser (HPL) products to lead-free for RoHS compliance - February 15, 2006
Notification of Counterfeit OSRAM Labels - February 14, 2007 (PDF - 447Kb) OS-IN-2006-035 -IPD213X Intelligent Displays: Use of alternate qualified seal glass material - December 29, 2006
OS-IN-2006-034 - Transfer of backend production line for "Smartled Low Height" products from OS Regensburg to OS Penang - December 29, 2006
OS-IN-2006-024 - Change of Humidity Indicator Card and Moisture Sensitivity Caution Label to meet J-STD-033B - December 29, 2006 OS-PCN-2006-030-A - Change of wire diameter from 25µm to 30µm and implementation of security bond for DIL / DIL-SMT-products - December 28, 2006
OS-PCN-2006-016-A - Harmonization of Large Area Phototransistor Products with Chip F144 - December 1, 2006
OS-IN-2006-031 - Introduction of Alternative Marking Method for OLED Display - November 8, 2006
OS-IN-2006-029 - Introduction of Jedec Level 2 for TOPLED/PowerTOPLED Longlife Package - November 8, 2006
OS-IN-2006-028 - Update of Dimming Diagram for InGaAlP standard green/puregreen Familiy- November 8, 2006
OS-PCN-2006-027-A - Introduction of Silicone Casting for certain InGaAlP PowerTOPLED devices - November 8, 2006
OS-PCN-2006-026-A - Introduction of 30µm bond wire for SmartLED devices - November 8, 2006
OS-PCN-2006-024-A - Modification of Wavelength binning for InGaN standard Truegreen Chip Family - November 8, 2006
OS-PCN-2006-003-B - Transfer of material production (epitaxy) to new location Regensburg/Burgweinting and change to 4 inch wafer size for pulse laser chips - November 8, 2006
OS-IN-2006-026 Improved Gel-Pak cover box for laser bars - November 8, 2006
OS-IN-2006-022 - Change of nominal length of laser bar (within data sheet specification) - November 8, 2006
