Xilinx Product Change Notifications

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Home > Line Card > Product Change Notices > Xilinx

Product Change Notices

Xilinx

XCN07024 - Spartan-3A/-3AN/-3A DSP Chip-Select Controlled SelectMAP and ICAP Data Loading 11/27/07
XCN07017 - Assembly Supplier & Material Changes for Xilinx Flip-Chip Products 9/4/07
XCN07015 - Assembly Location and Mold Compound Change for Platform Flash TSOP48 Packages 8/7/07
XCN06024 - Replacement of SAC+ Solder Balls By SACN Solder Balls for Platform Flash FBGA Devices 1/8/07

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