Low-Power Multi-Port Products

A3988 quad full-bridge motor driver

     
Eliminate Inter-Processor Communication Bottlenecks in High-End Handsets with Low-Power Multi-Ports.
     

The flexible, cost-effective multi-ports deliver access times as fast as 55 ns and data rates of 800 Mbps per port to clear out internal data flow bottlenecks. They provide maximum functionality while taking up minimum board space, with packages as small as 6mm x 6mm.

The IDT multi-ports have a 1.8V core voltage; and are available in configurations up to 32K x 16, and synchronous and asynchronous operation. They reduce operating and standby currents by up to 95 percent compared to traditional dual-ports. Operating current is only 15 mA (typ.) and standby current is just 2μA (typ.)
to help extend talk and standby times.

The architecture of IDT low-power multi-ports enables modular, reusable handset designs that can quickly be optimized to address different market requirements. The devices use a standard SRAM interface and support multiple voltage configurations, so existing application or baseband subsystems can be mixed and matched with minimal design effort, saving development time. These features help maximize the returns on system engineering investments, while also significantly shortening new-product design cycles.

The latest IDT low-power dual-port is a synchronous device with low pin count. This low-power, low pin count device offers an address/data multiplexed (ADM) interface to achieve a reduced pin count. The device is specifically designed to allow direct connection with several families of application processors, as well as processors for handsets and mobile applications that make use of an ADM interface. In addition, since the low-power, low pin count dual port can provide performance up to 800 Mbps per port throughput, it is the industry’s fastest low-power dual-port available.

The multi-ports’ innovative input/output circuitry can be used to implement higher levels of handset functionality. The devices’ Input Read and Output Drive registers enable the processors in a system to read the state of two external binary input devices (LEDs, DIP switches, etc.) and drive up to five external binary input devices, using only the standard memory interface of the multi-port. This allows the processors’ GPIO pins to be used for other purposes, facilitating extra or enhanced handset features that gain advantages in competitive markets.

     
     
   
     
To address the ever-increasing processing requirements of high-end, multimedia handsets, many manufacturers adopt dual-processor architectures. This approach provides the necessary computing performance, yet it also mandates a high-speed communication link between the two processors. Without IDT™ multi port devices the UART, USB and I2C interfaces built into the application and baseband processors can’t transfer data fast enough to keep pace with today’s 3G and 3.5G wireless standards and the applications that high-end phones run.

IDT low-power multi-port products address this problem directly. They deliver the requisite high data rates—unmatched throughput performance—combined with very low power consumption and space saving packaging. Beyond that, they offer advanced functions that help reduce the complexity and increase the modularity of wireless handset designs. See Figure 1.
     
     
The introduction and success of noncellular communication standards and the desire to support voice and data services across multiple geographies have led to the development of handset architectures that incorporate multiple baseband processors. IDT low-power multi-ports that have the tri-port architecture are ideal for supporting high-speed data transfers between both baseband processors and the application processor.

To maximize inter-processor communication, the multi-ports handle data rates as high as 290 Mbps per port between three processors. At the same time, they help decrease the phone’s power consumption, save space on the circuit board and provide enhanced design flexibility. See Figure 2.
     
     
Part # Technical Specs Package Type
70P35 8Kx18
1.8V core and I/O
100-ball fpBGA, TQFP
70P34 4Kx18
1.8V core and I/O
100-ball fpBGA, TQFP
70P258 8Kx16
1.8V core, 1.8V and 3.3/3.0/2.5V I/O
100-ball fpBGA
70P248 4Kx16
1.8V core, 1.8V and 3.3/3.0/2.5V I/O
100-ball fpBGA
70P25 8Kx16
1.8V core and I/O
100-ball fpBGA, TQFP
70P24 4Kx16
1.8V core and I/O
100-ball fpBGA, TQFP
70P27 32Kx16
1.8V core and I/O
144-ball fpBGA, TQFPFEATURED
     
     
 

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