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| Home > Line Card > Product Change Notices > Allegro |
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| Product Change Notices |
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- PCN - A1212LUA-T will be changing from the standard UA package to the UA Gate Relief Matrix package - May 10, 2012 (PDF - 671Kb)
- PTN - Assembly site is discontinuing package for the UDN2981A-T, UDN2982A-T, and UDN2987A-6-T devices - April 30, 2012 (PDF - 78Kb)
- PCN # JH3812 - Wafer diameter of the Allegro A4931METTR-T will be changing from 6 inch to 8 inch - March 9, 2012
- PSCN - A3230LLHLT-T and A3230LUA-T status change from Active to Not for New Design - February 8, 2012
- PCN - Allegro catalog part number ACS710KLATR-6BB-T will be changing to catalog part number ACS716KLATR-6BB-T - February 1, 2012
- Pre EOL PTN 102511 - NAM Disti UDN2982A-T - December 6, 2011
- PCN A3946KLPTR-T 2011 - Moving wafer fabrication from Allegro Worcester Massachusetts wafer fabrication to its sister plant, Polar Semiconductor - November 29, 2011
- PCN 4490 - A4490EESTR-T - Adjust the limits of the Under Voltage Lockout Test and Vdd Quiescent current - October 17, 2011
- PCN 1115 - Existing tube design incorporates a “top hat” profile for certan ACS7xx family parts - October 14, 2011
- PTN Pre-EOL Notice for the A1351KKTTN-T and A1354KKTTN-T (PDF) - August 18, 2011
- Last Time Buy Notice for UDx2916 (PDF) - July 19, 2011
- Last Time Buy Notice for A3953 (PDF) - July 19, 2011
- Last Time Buy Notice for A3955 (PDF) - July 19, 2011
- PCN 1028 - Allegro is adding a second source for our GTS magnet used to manufacture the SG, SH and SJ packages (PDF) - June 21, 2011
- PCN - Subcontractor has been qualified as an alternative source assembly location for the Allegro SOHED (SOT-23W) package (DOCX) - June 21, 2011
- PCN - Manufacturing location change for the silicon wafers used to make the ATS636LSETN-T (PDF) - June 20, 2011
- PCN - Package and Wafer size change for the A1101LUA-T (PDF) - May 16, 2011
- PCN - Package and Wafer size change for the A1101EUA-T (PDF) - May 16, 2011
- PCN - Manufacturing location change for the silicon wafers used to make A3230ELHLT-T, A3230LLHLT-T, A3230EUA-T, and A3230LUA-T (PDF) - May 13, 2011
- Last Time Buy Notice for May 2011 - Miscellaneous Parts (PDF) - May 13, 2011
- Last Time Buy Notice for A8435 (PDF) - May 13, 2011
- Last Time Buy Notice for A6279 (PDF) - May 13, 2011
- PCN WS1411 - Moving wafer fabrication from Allegro Worcester Massachusetts wafer fabrication to its sister plant, Polar Semiconductor, (PSI) located in Minneapolis Minnesota - May 9, 2011 (PDF - 684 Kb)
- PTN PRE EOL for NND parts going pre-EOL (PDF) - April 26, 2011
- PCN - A4983SETTR-T Change Assembly site from Carsem, Perak, Malaysia to StatsChipPac , Kuala Lumpur, Malaysia - March 11, 2011 (PDF - 686 Kb)
- PTN PRE EOL for UDN2916B-T, UDN2916EBTR-T, UDN2916LBTR-T, and UDQ2916 LBTR-T - February 25, 2011
- PTN PRE EOL for A3953SB-T and A3953SLBTR-T - February 25, 2011
- PTN PRE EOL for A3955SB-T, A3955SLBTR-T - February 25, 2011
- PCN - A3972SB-T Change Wafer Fabrication location from Allegro Worcester, Ma, USA to Polar Semiconductor (PSI) (PDF) - February 25, 2011
- PCN - A3959SB-T, A3959SLBTR-T, and A3959SLPTR-T Change Wafer Fabrication location from Allegro Worcester, Ma, USA to Polar Semiconductor (PSI) (PDF) - February 25, 2011
- PTN EOL for A1321ELHLT-T, A1321LLHLT-T, A1322LLHLT-T, A1323LLHLT-T, A1142ELHLT-T, A1143ELHLT-T, A1143LLHLT-T, A1145ELHLT-T, A1146ELHLT-T, A1146LLHLT-T, and A1180ELHLT-T - February 25, 2011
- PTN PRE EOL for ATS643LSHTN-I1-T, ATS643LSHTN-I2-T, A3242LLHLT-T, and A1665LK-T (DOC) - February 25, 2011
- PCN - Product Status Change due to Wafer Fab Closure (DOC) - February 25, 2011
- PCN - A3940KLPTR-T Moving wafer fabrication from Allegro Worcester Massachusetts wafer fabrication to its sister plant, Polar Semiconductor, (PSI) (PDF) - February 25, 2011
- PCN - A3935KLQTR-T Moving wafer fabrication from Allegro Worcester Massachusetts wafer fabrication to its sister plant, Polar Semiconductor, (PSI) (PDF) - February 25, 2011
- PCN - Manufacturing location change for the silicon wafers used to make A3213EELLT-T, A3213ELHLT-T, A3213EUA-T, A3214ELHLT-T (PDF) - February 25, 2011
- PCN 1030 - Allegro MicroSystems is changing the top marking method from "ink" brand to "laser" brand for A3425LK-T, A3425EK-T, A1230LK-T, A3423LK-T, A1230LLTR-T, A1422LK-T, A1421LK-T, and A1665LK-T - January 17, 2011 (PDF - 811 Kb)
- PTN PRE EOL A1142, A1143, A1145 & A1146 - December 15, 2010
- NA Asia Distribution Last Time Buy April 30, 2011 (PDF) - October 20, 2010
- Last Time Buy Notice for A6275ELWTRT (PDF) - October 20, 2010
- PRE_EOL Status for UDN2916BT,UDN2916EBTRT,A6279EETTRT, and A6279ELPTRT (PDF) - October 20, 2010
- PCN 921 - Adding Additional Assembly site Carsem for 5x5 QFN packages - October 8, 2010 (PDF - 83 Kb)
- PCN - Change of wafer fabrication site from Allegro MicroSystems, Worcester, MA, USA to wafer fabrication site Polar Semiconductor for 3967,2981,2982 & 2987 - October 4, 2010 (PDF - 792 Kb)
- PCN 1025/03 - The 24 lead TSSOP tie bar design changes from a single tie bar lead frame to a two tie bar lead frame - August 17, 2010 (PDF)
- PCN - ACS760ELFTR-20B-T: Reduction of the final test temperature from 85C to 65C - May 11, 2010 (DOC)
- PCN - Standardized labeling format inner/outer box shipping labels - March 9, 2009 (DOC)
- PCN #3906 - A3906SESTR-T Data Sheet Change - March 8, 2010 (PDF)
- PCN - Standardized labeling format inner/outer box shipping labels - December 2, 2009 (PDF)
- Product Termination Notice for Smoke detector ICs - November 23, 2009 (PDF)
- PCN #909 - A1106ELTTR-T: Addition of a second supplier of the SOT 89 (LT Package) tape and reel carrier and cover tape - July 22, 2009 (PDF)
- PCN #829 - A6282EESTR-T: Assembly site and wire bond change from 1.3mil gold wire to 1.0 mil copper wire - December 31, 2008 (DOC)
- Product Change Notice - A3977SLPTR-T, A3977KLPTR-T, A3979SLPTR-T, A8904SLPTR-T 28 TSSOP-EP tie bar design change - December 29, 2008 (DOC)
- Product Change Notice - Standard increment change for surface mount devices - bulk vs tape and reel - November 3, 2008 (PDF)
- Product Change Notice - Shipping Tube Change - October 17, 2008 (DOC)
- Product Change Notice - A3214EUALC - September 10, 2008 (PDF)
- Product Change Notice - A3940 SOIC Molding Compound Change - August 26, 2008
- Product Change Notice - Change Assembly Location from Allegro MicroSystems, Philippines (AMPI) to Carsem, Perak, Malaysia - June 4, 2008
- Product Status Change Notice - Sensor Products - AMS-601AB - May 14, 2008 (DOC - 35Kb)
- PCN #643S - Addition UA Matrix Lead Frame Assembly Option - March 28, 2008 (DOC - 39Kb)
- Product Change Notice A3977 & A3979 - January 24, 2008 (DOC - 34Kb)
- Product Change Notice - A3950/A3992 - January 24, 2008 (DOC - 34Kb)
- Product Status Change Notice - A6595KA "LTB" Status - November 13, 2007 (DOC - 26Kb)
- Product Status Change Notice - A6801SA-T "NND" Status - November 13, 2007 (DOC - 26Kb)
- Product Change Notice -
A3938SLDTR-T, A3938SLD-T, A3938SLD, A3938SLDTR, A3938SEQ ,A3938SEQTR - October 2, 2007 (DOC - 37Kb)
- Product Change Notice - Sensor Sumitomo Molding Compound - July 13, 2007 (DOC - 60Kb)
- Product Change Notice - A3946's - July 12, 2007 (DOC - 39Kb)
- Product Change Notice - Molding Compound - July 12, 2007 (DOC - 41Kb)
- Product Change Notice - A3964SLB-T & A3964SLBTR-T - July 12, 2007 (DOC - 41Kb)
- PCN - A3982 83 84 - June 12, 2007 (DOC - 37Kb)
- Product Status Change Notice - 18-lead SOIC package - June 12, 2007 (DOC - 37Kb)
- Product Status Change Notice - A3932SEQTR-T - June 12, 2007 (DOC - 27Kb)
- Product Change Notice - Molding Compound - May 23, 2007
- Product Status Change Notice - Sensor Product Line - May 17, 2007 (PDF - 29Kb)
- Product Status Change Notice A3940's as noted in the AMS-601Z Price Schedule - May 7, 2007 (DOC - 27Kb)
- Product Status Change Notices - Effective in the AMS-601Z Price Shedule - May 7, 2007
- Product Status Change Notice A3932SEQTR-T - April 11, 2007
- PCN - UA Lead Frame Sensors - February 23, 2007
- PCN - Molding Compound for Smokes product line - February 23, 2007
- PCN - IC Molding Compound Change - February 12, 2007
- PCN A394xx Molding Compound Change - February 9, 2007
- Product Status Change Notification - January 16, 2007
- Product Status Change Notification - A3281 "E" temperature range - December 8, 2006 (DOC - 30Kb)
- 2SC4299, 2SC4517, 2SC5124, and 2SC5271 EOL Notification - November 17, 2006 (PDF - 66Kb)
- Allegro Process Change Notification - November 7, 2006
- Product change Notice 2559's Ink Brand to Laser Brand - October 19, 2006
- HVR-1X discontinued - August 10, 2006
- Allegro 24 LB AMPI Assembly PCN - July 12, 2006
- Allegro A3977ED Addition of Carsem Test - July 12, 2006
- Addition of STATS chip PAC as an Alternate source for Assembly - July 12, 2006
- Lead-Solder Plated Products NND - July 12, 2006
- A8450KLB-T LASER BRAND PCN - July 12, 2006
- A8450KLB LASER BRAND PCN - July 12, 2006
- A6810SLW-T LASER BRAND PCN - July 12, 2006
- A6810KLWTR LASER BRAND PCN - July 12, 2006
- A6810ELW LASER BRAND PCN - July 12, 2006
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Electronic Components Distributor
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Reproduction in whole, or in part, without the written permission of the copyright holder is prohibited.
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