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| Home > Line Card > Product Change Notices > Epson |
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| Product Change / EOL Notices |
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- PCN for QFP Tray Change of PKG Products -
September 30, 2011
- PCN for QFP Molding Compound Change of PKG Products -
September 30, 2011
- PCN for the Change of Package Manufacturing Factory -
September 30, 2011
- PCN for the Molding Compound and PKG Marking Change of PKG Products -
September 30, 2011
- PCN for BGA Tray Change of PKG Products -
September 30, 2011
- PCN for BGA Molding Compound Change of PKG Products -
September 30, 2011
- EOL Notification of certain products with the FCBGA package substrate - September 15, 2011 (PDF - 45 Kb)
- EOL Notification of S1R72901 & S1R72902 parts - June 7, 2011 (PDF - 27 Kb)
- S1R81006F00C200, S1D13502F00B200, S1R81100F00A200 - October 20, 2009
- Product
Change Notice for the CA-301 4.0MHz ~ 5.0MHz Crystals -
February 17, 2006
- PCN
Letter SG RTC IC -
August 5, 2005
- PCN
Letter SG RTC IC -
August 5, 2005
- Reliability
Data SG-PH -
August 5, 2005
- Reliability
Data SG-P 636PTF E -
August 5, 2005
- SG636SCE
comparison -
August 5, 2005
- SG636PDE
comparison -
August 5, 2005
- SG636PCE
comparison_Rev2 -
August 5, 2005
- SG636PTF
comparison -
August 5, 2005
- SG615,531,51,636PH
comparison -
August 5, 2005
- SG615,531,51P
comparison -
August 5, 2005
- FC-255
New Production location -
December 09, 2003
- QFP12-48
pin lead frame - June 12,
2000
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Electronic Components Distributor
All Rights Reserved
Reproduction in whole, or in part, without the written permission of the copyright holder is prohibited.
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