• Last Time Buy Notice April 2012 - April 30, 2012 (PDF - 153Kb)
• PCN 2012-115 - Transition to Copper Wire as a qualified wire bond material for certain USBxxxx family products - April 17, 2012 (PDF - 20Kb)
• PCN-2012-114 - Conversion of Punch-singulated QFNs to Saw-singulated QFN for 24, 28 and 32 pin QFN packages - March 20, 2012 
• PCN-2012-113 - Addition of SCM as an assembler of 8 pin TDFNe4 packages - February 28, 2012 
• PCN-2011-111 - Change PLCC assembler from ASE to OSE - February 27, 2012 
• PCN-2011-97 - Add Copper Wire as qualified bond wire material for QFN and VTQE3 - February 13, 2012 (PDF - 18Kb)
• PCN-2011-109 - Transition of Copper Wire as qualified bond wire material for SMSC's USX2065 device - October 6, 2011 
• PCN-2011-107 - Changing of ball alloy SAC105 code in marking of BGA components - October 5, 2011 (PDF - 18Kb)
• PCIN-2011-108 - Change of PLCC assembler from ASE to CEI - October 5, 2011 (PDF - 18Kb)
• PCN-2010-88 - Transfer of LAN8710A, LAN8720A, & LAX9010 to qualified copper wirebond - August 26, 2011 (PDF - 17 Kb)
• PCN-2011-86C - Transfer of USB251xB-AEZG to qualified copper wirebond device - August 16, 2011 
• QAR 2009-031B - Evaluation and Qualification of the Cu Wire for QFN Packages at ASEK - August 16, 2011 (PDF - 4Mb)
• QAR2010-011 - Evaluation and Qualification of the CuPd Wire for QFNE3/SQFNE3 Packages at SCM - August 16, 2011 (PDF - 3Mb)
• QAR2010-028 - Evaluation and Qualification of the CuPd Wire for QFNE3/SQFNE3/DQFNE3 Packages at CTI - August 16, 2011 (PDF - 9Mb)
• PCN-2011-86B - Transfer of USB2512B-AEZG & USB2412-DZK to qualified copper wirebond - August 16, 2011 
• PCN-2011-106 - Transition of Copper Wire as qualified bond wire material for certain LAN9xxx devices - August 16, 2011 
• PCN-2011-103 - Add Cu wire as qualified wire material for 144LFBGe1 for MEC1609-PZP and MEC1609I-PZP - June 15, 2011 (PDF - 15 Kb)
• PCN-2011-96 - Addition of Hana and SCM as assemblers of 10 pin DFNe4 (2) - May 4, 2011 (PDF - 19 Kb)
• PCN-2011-99 - Addition of die-attach epoxy Sumitomo CRM1076 affecting QFNe3/QFNe3C packages - May 2, 2011 (PDF - 26 Kb)
• PCN-2011-98 - Addition of die-attach epoxy Sumitomo CRM1076 and Molding compound Sumitomo G631H in TQe3/VTQe3/TQe3C/VTQE3C/STQE3/STQE3C - April 18, 2011 (PDF - 28 Kb)
• PCN-2011-96 - Addition of Hana and SCM as assemblers of 10 pin DFNe4 - April 18, 2011 (PDF - 19 Kb)
• PCN-2011-95 - Addition of Molding Compound Sumitomo EME-G631B to QFNs bonded with Au and Cu wire - April 18, 2011 (PDF - 23 Kb)
• PCN-2011-101 - Addition of die-attach epoxy Sumitomo CRM1076 and Molding compound Sumitomo G631H affecting QE3/MQE3/QE3C/MQE3C - March 31, 2011 (PDF - 20 Kb)
• PCN-2011-100 - Addition of die-attach epoxy Sumitomo CRM1076 affecting SQFNe3/SQFNe3C packages - March 31, 2011 (PDF - 22 Kb)
• PCN-2011-102 - Addition of die-attach epoxy Sumitomo CRM1076 affecting DQFNE3/DQFNE3C packages - March 28, 2011 (PDF - 19 Kb)
• PCN-2011-101 - Addition of die-attach epoxy Sumitomo CRM1076 and Molding compound Sumitomo G631H affecting QE3/MQE3/QE3C/MQE3C - March 28, 2011 (PDF - 20 Kb)
• PCN-2011-100 - Addition of die-attach epoxy Sumitomo CRM1076 affecting SQFNe3/SQFNe3C packages - March 28, 2011 (PDF - 22 Kb)
• PCN-2011-94 - Transition from Functional Rev B to Functional Rev C for CAP11xx devices - March 23, 2011 (PDF - 17 Kb)
• PCN-2011-92 - Addition of ASE as an assembler of 64 pin QFNE3/QFNE3C - March 15, 2011 (PDF - 19 Kb)
• PCN-2011-93 - Addition of OSE is an assembler of 24 pin SSOP - March 14, 2011 (PDF - 17 Kb)
• PCN-2010-62 - Transition from USB2514-xxx to USB2514B-xxx - February 10, 2011 (PDF - 23 Kb)
• PCN-2010-61 - Transition from USB2513-xxx to USB2513B-xxx - February 10, 2011 (PDF - 23 Kb)
• PCN-2010-60 - Transition from USB2512-xxx & USB2512A-xxx to USB2512B-xxx - February 10, 2011 (PDF - 23 Kb)
• PCN-2011-90 - Addition of NEPES as an assembler of 25DSE1 package (WLCSP) for devices USB3321C-GL and USB3322C-GL - January 26, 2011 (PDF - 17 Kb)
• PCN-2011-91 - Transition of USB224x-AEZG-05 & USB225x-AEZG-05 to USB224x-AEZG-06 & USB225x-AEZG-06 - January 21, 2011 (PDF - 17 Kb)
• LTB October 2010 - Customer Letter (PDF) - October 20, 2010 
• LTB October 2010 - Product List (PDF) - October 20, 2010 
• PCN-2010-82 - Addition of STATSChipPack Malaysia as assembler of 24 pin QFNe3 - August 17, 2010 (PDF - 19 Kb)
• PCN-2010-79 - Addition of NEPES as a supplier of WLCSP - July 6, 2010 (PDF - 17 Kb)
• PCN-2010-78 - Transfer of manufacturing to Sohard Industrial Solutions for the HYC9088A R-LF - June 21, 2010 (PDF - 16 Kb)
• LTB Jan2010 Device Matrix - April 29, 2010 
• PCN-2010-66 - Transfer of manufacturing from Chartered Fab 6 to TSMC Fab 8B for USB331x & USB332x devices - April 27, 2010 (PDF - 19 Kb)
• PCN-2010-68 - Transition from revision A to revision B for LAN8710A and LAN8720A - April 27, 2010 (PDF - 17 Kb)
• PCN 2010-71 USB224x and 225x Fab Change - April 27, 2010 (PDF - 17 Kb)
• PCN 2010-70 USB2524 Fab Change - April 12, 2010 (PDF - 17 Kb)
• PCN 2010-69 Inner Box Qty Change - April 8, 2010 (PDF - 20 Kb)
• PCN-2010-65- PCN to use Copper Wire in the QFN Packages - February 16, 2010 (PDF - 17 Kb)
• PCN-2010-55 - Transition from LPC47M172-NW to LPC47M182-NW - January 20, 2010 (PDF - 18 Kb)
• PCN-2009-53 - Add Copper Wire as Qualified Bill of Material for Assembly for 128 and 100 pin VTQe3/TQe3/MQe3 and Qe3 - December 29, 2009 (PDF - 21 Kb)
• PCN- 2009-45- Transfer of manufacturing from Chartered Fab 6 to Chartered Fab 5 for SMSCs LAN9220 and LAN9221 devices - September 30, 2009 
• PCN-2009-40 - Addition of molding compound Sumitomo G630 - September 14, 2009 
• PCN-2009-41 - Addition of molding compound Sumitomo G630 (PDF) - September 11, 2009 
• PCN-2009-43 - Transition from revision A to revision B for USB264x - August 25, 2009 
• PCN-2009-42- Transition from revision B to revision C for USB2517-JZX - August 25, 2009 
• PCN-2009-39 - Notification of Additional Final Test Source (PDF) - July 2, 2009 
• PCN-2009-36 - Moisture Caution Label Change (PDF) - June 1, 2009 
• LTB for Leaded Packaged Devices, May 2009 (PDF) - May 7, 2009 
• PCN-2009-34 - Addition of UTL as a supplier of 10 pin DFNe4 package (PDF) - March 11, 2009 
• LTB for HYC9088A R (DOC) - February 23, 2009 
• PCN-2008-20 - Transition from USB2512 to USB2512A (PDF) - August 18, 2008 
• LTB August 2008 (PDF) - August 11, 2008 
• PCN # 2008-04 - Addition of ASE as an Assembler of 56 pin QFNe3 Package (PDF - 19Kb) - April 11, 2008 
• PCN # 2007-25 - Addition of a foundry source - TSMC for USB2503A and USB2504A (PDF - 19Kb) - March 31, 2008 
• PCN # 2008-03 - Addition of ChipMOS as an Assembler of 100 Pin TQe3 Package (PDF - 19Kb) - March 6, 2008 
• PCN # 2008-02 - Recommendations for peak reflow temperature change for 14x20x2.7mm body QFP package (PDF - 87Kb) - January 28, 2008 
• PCN # 2008-01 - Addition of ATT (Amkor Taiwan) as an assembler of 128 Pin VTQe3 Package (PDF - 19Kb) - January 22, 2008 
• PCN # 2007-015 - Addition of OSE (Taiwan) as an assembler of 100 Pin TQe3 Package (PDF - 19Kb) - December 20, 2007 
• PCN # 2007-024 - LAN8187 GÇô Transition from Functional Revision B to Revision C (PDF - 19Kb) - October 11, 2007 
• PCN # 2007-023 - LAN8700 GÇô Transition from Functional Revision B to Revision C and change of catalog part number to identify functional revision level (PDF - 19Kb) - October 1, 2007 
• PCN # 2007-021 - Transition from USB2601/2602-NU-02 to USB2601/2602-NU-05 (PDF - 19Kb) - September 26, 2007 
• PCN # 2007-020 - USB2513/2514 GÇô Transition from Functional Revision B to Revision C (PDF - 20Kb) - September 21, 2007 
• PCN # 2007-014 - Addition of CTI as an assembler of 100Qe3 and MQe3 packages - August 14, 2007 
• LTB, June 2007 (Leaded SKUs) - Customer Letter (PDF - 16Kb) - June 1, 2007 
• LTB, June 2007 (Leaded SKUs) - Product List (PDF - 14Kb) - June 1, 2007 
• PCN #2007-003 - Addition of GAPT (ASE China) as an assembler of 128 Qe3 & MQe3 packages - April 26, 2007 
• PCN # 2007-002 - Addition of Amkor China (ATC) as an assembler of QFNe3 packages - April 19, 2007 
• PCN #2007-003 - Addition of GAPT (ASE China) as an assembler of 128 Qe3 & MQe3 packages - March 29, 2007 
• PCN #2007-001 - Addition of StatsChipPac Malaysia (SCM) as an assembler of QFNe3 packages - March 14, 2007 
• Last Time Buy February 2007 - Customer Letter (PDF - 16Kb) - March 6, 2007 
• Last Time Buy February 2007 - Product List (PDF - 13Kb) - March 6, 2007 
• PCN #2006-036 - Addition of ChipMOS as an assembler of 128VTQe3 packages - January 30, 2007 
• PCN # 2006-040 - LAN91C93I-ME, LAN91C93I-MU, LAN91C96-MU, LAN91C96I-MU, LAN91C96TQFP, LAN91C96ITQFP - December 22, 2006 
• PCN # 2006-042 - Addition of OSE as assembler of 8 pin and 10 pin TSSOe3 packages - December 22, 2006 
• PCN # 2006-038 - December 1, 2006 
• Last Time Buy March 2006 - Product List - March 3, 2006 (PDF - 16Kb)
• Last Time Buy March 2006 - Customer Letter - March 3, 2006 (PDF - 16Kb)
• PMPCN# 2006-003 - January 13, 2006

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