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| Home > Line Card > Product Change Notices > Winbond |
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| Product Change / EOL Notices |
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- EOL Notice for the W25X40B and W25Q40B SpiFlash Memories - May 3, 2012 (PDF - 62Kb)
- PCN-DM201204-01-A - W25Q40/X40 "C-Series" (90nm) to replace W25Q40/X40 "B -Series" (90nm) 4Mb SpiFlash® Memories - May 3, 2012 (PDF - 186Kb)
- APCN-DM201204-01-P - W25Q "F-Series" (58nm) to replace W25Q "B-Series" (90nm) 32Mb SpiFlash® Memories - April 18, 2012 (PDF - 169Kb)
- PCN-TM201203-01-B - W25X10/X20 "C-Series" (90nm) to replace W25X10/X20 "B -Series" (90nm) 2Mb/1Mb SpiFlash® Memories - April 12, 2012
- APCN-DM201203-01-P - 256M DDR2 technology migration from 65nm to 46nm - April 6, 2012
- APCN-DM201109-01-P - W25Q "F-Series" (58nm) to replace W25Q "B/C-Series" (90nm) 64Mb SpiFlash(r) Memories - January 6, 2012
- PCN-DM201111-01-A - 2Mx32 SDR with TSOP 86L package technology migration from 90nm to 65nm - November 18, 2011
- APCN-W6201109-01-P - Flash with 90nm technology Metal 1 Al and ARC Ti thickness change - November 14, 2011
- Z200-APCN-W6201109-01-P - [Advanced PCN] Flash with 90nm technology Metal 1 Al and ARC Ti thickness change - September 29, 2011
- PCN-PM201105-01-B - Add an new Tape-and-Reel material supplier, ACTECH, for all products - June 29, 2011 (PDF - 116 Kb)
- PCN-PM201106-01-A - Add an additional assembly site, Greatek, for SON 8L (5x6 mm) package - June 29, 2011 (PDF - 124 Kb)
- PCN-PM201104-01-A - Add an additional assembly site, ChipMOS, for WBGA 84B (8x12.5 mm) package - April 13, 2011 (PDF - 114 Kb)
- APCN-PM201104-01-A - Add MCT as additional BGA substrate vendor for LFBGA 144B (12x12 mm) - April 13, 2011 (PDF - 145 Kb)
- PCN-TM201104-01-A - Add an additional assembly site, ChipMOS, for WBGA 84B (8x12.5 mm) package - April 13, 2011 (PDF - 115 Kb)
- APCN-W6201102-01-A - Modification of capacitor dielectric (ZAZ) process - March 2, 2011 (PDF - 452 Kb)
- PCN-DM201102-01-A - Technology migration from 90nm to 65nm --- 16Mx16 DDR with TFBGA 60B package type - March 2, 2011 (PDF - 99 Kb)
- PCN Z200-APCN-TM201102-01- A Movement plan of one DRAM Chip probing testing site - February 28, 2011 (PDF - 96 Kb)
- PCN-TM201012-01-A - Winbond will move 2M & 4M Serial Flash product with SOP8 (150mil) package Final Test (FT) Testing Site from ASE SH to ASE KS - January 4, 2011 (PDF - 112 Kb)
- PCN-PM201012-01-A - Winbond will move 2M & 4M Serial Flash product with SOP8 (150mil) package assembly site from ASE SH to ASE KS - January 4, 2011 (PDF - 70 Kb)
- PCN-PM201011-01-A - Add an additional assembly site, ChipMOS, for LOC-type TSOP(II) 54L package - November 17, 2010 (PDF - 96 Kb)
- PCN-PA201011-02-A - Add an additional assembly site, ChipMOS, for LOC-type TSOP(II) 66L package - November 17, 2010 (PDF - 96 Kb)
- EOL 2010-09-DC3002 W9825G2DB_DH - September 29, 2010 (PDF - 45 Kb)
- PCN-PM201009-01-A - Add an additional assembly site, ChipMOS, for non-LOC type TSOP(II) 54L package - September 24, 2010 (PDF - 75 Kb)
- PCN-PA201008-01-A to add an additional assembly site, ChipMOS, for TSOP II 66L package - August 27, 2010 (PDF - 89 Kb)
- EOL Notice 1260-0009-02-A - W19B320B & W19B160B 130nm Parallel Flash Memories - August 19, 2010 (PDF - 59 Kb)
- APCN-DM201005-01-A - W9825G6EH and W9425G6EH SDR/DDR technology migration from 90nm to 65nm - May 24, 2010 (PDF - 108 Kb)
- PCN-PM201004-01-A - Add additional Assembly site, Gerad Suzhou for WBGA 84Ball - May 11, 2010 (PDF - 111 Kb)
- PCN-TM201004-05-A - Add an additional final testing site, Gerad Technologies Suzhou, for 64Mx16 DDR2 WBGA 84 ball - May 11, 2010 (PDF - 150 Kb)
- PCN-DM201001-03-A and APCN-DM201001-02-A update - W9412G6JH series and W9812G6JH series Rel. Report - April 27, 2010 (PDF - 706 Kb)
- PCN-DM201003-02-A - PCN notification for 4Mx16 SDRAM with VFBGA60 package type technology migration from 110nm to 65nm - April 12, 2010 (PDF - 106 Kb)
- PCN-DM201003-01-A - W9864G6IH (4Mx16 SDRAM technology) migration from 90nm to 65nm - March 23, 2010 (PDF - 124 Kb)
- PCN-DM201001-04-A - EOL Notice for W9464G6IH (4Mx16 DDR DRAM with 90nm technology) - February 8, 2010 (PDF - 105 Kb)
- PCN-DM201001-03-A - EOL Notice for W9412G6IH (8Mx16 DDR DRAM with 90nm technology) - February 8, 2010 (PDF - 105 Kb)
- PCN-DM201001-02-A - EOL Notice for W9725G6IB (16Mx16 DDR2 DRAM with 90nm technology) - February 8, 2010 (PDF - 105 Kb)
- PCN-DM201001-01-A - EOL Notice for W9751G6IB (32Mx16 DDR2 DRAM with 90nm technology) - February 8, 2010 (PDF - 105 Kb)
- PCN-PM2001001-01-B - Change the Winbond 1D2D label format - February 8, 2010 (PDF - 264 Kb)
- APCN-DM201001-02 - EOL Notice for W9812G6IH (8Mx16 SDRAM with 90nm technology) - February 8, 2010 (PDF - 105 Kb)
- APCN-DM201001-01-A - EOL Notice for W9864G6IH (4Mx16 SDRAM with 90nm technology) - February 8, 2010 (PDF - 111 Kb)
- PCN-TM200912-02-A - Add an additionalfinal testing site, ChipMOS, for 32M/64M serial flash with SOP 16 (300 mil) package (PDF) - December 30, 2009
- PCN-PM200910-02-A - Add an additional Tape and Reel site, Powertech Technology Inc., for SOIC family package (PDF) - October 30, 2009
- PCN-PM200910-01-A - Add an additional Tape-and-Reel site, SMONDA, for WBGAfamily package (PDF) - October 30, 2009
- PCN-TM200909-01 -A To add an additional final testing site, Powertech, for 2M/4M/8M/16M serial flash product with SOP 8L 150/208mil package (PDF) - September 16, 2009
- Z200-APCN-DM200908-01-P - August 28, 2009
- Z200-PCN-DM200908-01-A - August 28, 2009
- Z200-PCN-TM200908-01-A: To add an additional testing site, ChipMOS , for 2M/4M serial flash products with SON 8 5x6 mm2 package - August 21, 2009
- Z200-APCN-DM200908-01-P: W25Q GÇ£B-SeriesGÇ¥ (90nm) to replace W25X & W25Q (130nm) 32Mb-64Mb SpiFlash-« Memories - August 21, 2009
- Z200-APCN-DM200908-01-P: W25Q GÇ£B-SeriesGÇ¥ (90nm) to replace W25X & W25Q (130nm) 32Mb-64Mb SpiFlash-« Memories - August 21, 2009
- PCN-PA200907-01-A: To Add WAE-W1 as assembly site of Flash product with SON 8L (5x6 mm2) package - July 23, 2009
- Flash Products Final Test (FT) Testing Site Change --- WAE SZ for Flash product with SON 8L (5x6 mm) package - July 21, 2009
- PCN-DM200906-01-A 2Mx32 SDR/DDR DRAM technology migration from 110nm to 90nm (PDF) - June 25, 2009
- PCN-PA200904-03-A - Add an additional assembly site, Walton-Suzhou , for Flash product with SOP8L/150 mil package (PDF) - May 6, 2009
- PCN-TM200904-01-A - Flash Products Final Test (FT) Testing Site Change --- WAE SZ for Flash product with SOP 8L 150mil/208mil package (PDF) - May 6, 2009
- PCN-PA200904-02-A - Add an additional Tape-and-Reel site, Walton-Suzhou, for Flash product with SOP8L/150 mil package (PDF) - May 6, 2009
- APCN-PA200903-01-P - Add WAE-W1 as assembly site of Flash product with SOP 8L (150mil) and SON 8L (5x6 mm2) package (PDF) - April 13, 2009
- APCN-TM200902-01-P - Flash Products Final Test (FT) Testing Site Change (PDF) - March 23, 2009
- PCN-TM200903-02 - Add an additional testing site, ASESH, for 1M/2M serial Flash with SOP 8L (150ml) package (PDF) - March 20, 2009
- PCN-PM200903-01 - Add an additional Tape-and-Reel site, ASESH, for 1M/2M serial Flash with SOP 8L (150ml) package (PDF) - March 20, 2009
- PCN-TM200903-03-A Affected Products (PDF) - March 20, 2009
- PCN-TM200903-03-A - Flash Products Final Test (FT) Testing Site Change - KYEC (PDF) - March 20, 2009
- PCN-PM200903-03 - Add an additional assembly site, FATC, for LFBGA144L (12X12 mm2) package (PDF) - March 19, 2009
- PCN-PM200812-01MB - Add an additional Tape-and-Reel site, KYEC, for Flash product with SOP 8L and SON 8L package (PDF) - January 20, 2009
- W39V040FC/W39V040C EOL - January 20, 2009
- PCN-PA200811-05M-XH - Add a new Tape and Reel site, WAE, for DRAM products with TSOP package (PDF) - December 1, 2008
- PCN-PA200811-05M - Add a new Tape and Reel site, WAE, for DRAM products with TSOP and BGA package (PDF) - December 1, 2008
- PCN-PA200810-02M - Add an additional Tape-and-Real site, FATC, for TSOPII 50L/54L/66L/86L package (PDF) - December 1, 2008
- PCN-PA200811-04MB - Add a new assembly site, ASE SH, for SOP 8L (150mil) package (PDF) - December 1, 2008
- PCN-PA200811-04M - Add a new assembly site, ASE SH, for SOP 8L (150mil) package (PDF) - December 1, 2008
- PCN-PA200811-06M - Eliminate CoCl2 in desiccant and humidity indicator card (PDF) - December 1, 2008
- PCN-TM200811-01MB - Testing subcon name change from KYEC to KPT (PDF) - December 1, 2008
- W24257S-70LL End of Life Notice - October 23, 2008
- PCN DM200810-01- M4Mx32 SDR/DDR DRAM technology migration from 110nm to 90nm - October 20, 2008
- W83303G/W83303D End of Life Notice - June 19, 2008 (PDF - 277Kb)
- PCN-PA200804-04MB - Add additional Tape-and-Reel site, TCPC, for TSOPII 50L/54L/66L/86L package - June 11, 2008 (PDF - 239Kb)
- PCN-PA200805-01MB - Add additional Assembly site, Greatek, for SOP 16L (300mil) green package - June 10, 2008 (PDF - 224Kb)
- PCN-PA200806-01L - Change the logo on packing material from Winbond to Nuvoton - June 4, 2008 (PDF - 612Kb)
- PCN-PA200804-03MB - Add additional Tape-and-Reel site, Walton (SuZhou), for SOP 8L (208 mil) package - May 7, 2008 (PDF - 224Kb)
- PCN-PA200804-02M - Change Winbond logo on packing material - April 29, 2008 (PDF - 744Kb)
- W83627EHF End of Life Notice - April 29, 2008 (PDF - 268Kb)
- W25X10/20/40/80 0.18um SpiFlash Memories End of Life Notice - April 21, 2008 (PDF - 501Kb)
- PCN-DM200804-01MB - 16Mb SDR DRAM technology migration from 130nm to 90nm - April 14, 2008 (PDF - 157Kb)
- PCN-DM200804-04MB - 128Mb SDR/DDR DRAM technology migration from 110nm to 90nm - April 14, 2008 (PDF - 160Kb)
- PCN-DM200804-02M - 64Mb (4Mbx16) SDR DRAM technology migration from 110nm to 90nm - April 14, 2008
- PCN-DM200801-01 - W25X10/20/40/80/16 "A series" to replace W25X10/20/40/80/16 (non-A) Serial Flash Memories - April 8, 2008 (PDF - 160Kb)
- W39V040FBPZ/W39V040BPZ End of Life Notice - April 1, 2008 (PDF - 273Kb)
- PCN - W6200802-01B - Add a new 300mm wafer fab site for 64Mb (2Mx32) SDR and 128Mb (4Mx32) SDR/DDR DRAM - March 14, 2008 (PDF - 177Kb)
- W83L351G End of Life Notice - March 5, 2008 (PDF - 273Kb)
- PCN - Z200-PA200802-02C - Add additional Assembly site, WAE, for SOP 8L (208mil) lead free package - February 29, 2008 (PDF - 226Kb)
- PCN - PA200802-03 - Add additional Tape-and-Reel site, TCPC, for SOP 8L package - February 29, 2008 (PDF - 230Kb)
- PCN-DM200801-01 - 256Mb SDR/DDR DRAM technology migration from 110nm to 90nm - January 28, 2008 (PDF - 161Kb)
- WMSxxx Series End of Life Notice - January 23, 2008 (PDF - 1Mb)
- W83176R-400/W83176G-400/W83176R-401/W83176G-401 End of Life Notice - January 15, 2008 (PDF - 464Kb)
- W83628F/W83628G/W83629D/W83629G End of Life Notice - January 14, 2008 (PDF - 281Kb)
- W742C810/W742C81D/W742C81B/W742C818 End of Life Notice - January 11, 2008 (PDF - 268Kb)
- W39V080FA/W39V080A End of Life Notice - January 11, 2008 (PDF - 268Kb)
- ISD5216PY End of Life Notice - January 8, 2008 (PDF - 265Kb)
- PCN PA200711-03 - Add 2nd source of TSSOP 28L 4.4X9.7MM^2 assembly house - December 5, 2007 (PDF - 227Kb)
- ISD 16-pin PDIP Package Discontinuance Notice - November 9, 2007 (PDF - 80Kb)
- End of Life Notice - VC Multimedia Products - October 4, 2007 (PDF - 122Kb)
- End of Life Notice - ISD11XX series - September 4, 2007 (PDF - 67Kb)
- End of Life Notice - WTS - August 24, 2007
- End of Life Notice - W742X816 - August 22, 2007
- End of Life Notice - W25Pxx and W25Bxx Serial Flash Family - July 30, 2007 (PDF - 90Kb)
- End of Life Notice W6810I, W6811, W681310, W681360, W681511, W681512, W681513, W682310, W682510 leaded package - July 5, 2007 (PDF - 75Kb)
- End of Life Notice W83782 and W83791 Leaded Package - July 3, 2007 (PDF - 62Kb)
- End of Life Notification - W27/W29/W39L/W39V series EPROM/Flash - July 3, 2007 (PDF - 77Kb)
- End of Life Notice-W83697UF/ W83977AF-A, W83977EF-AW, W83977F-A, W83877ATF, W83627HF-AW, W83977ATF-AW, W83637HF-AW, W83627THF - June 28, 2007 (PDF - 68Kb)
- End of Life Notice - W83C553/W83C554 with leaded package - Revised - May 18, 2007 (PDF - 77Kb)
- End of Life Notice - Text-To-Speech with leaded package - May 14, 2007 (PDF - 73Kb)
- End of Life Notice - W83C553/W83C554 with leaded package - May 14, 2007 (PDF - 74Kb)
- End of Life Notice - W86L388D_W86L387D - May 14, 2007 (PDF - 67Kb)
- End of Life Notice--W6810IW, W6811IW, W681310W, W681360W, and W681512W with leaded TSSOP package - May 8, 2007 (PDF - 77Kb)
- End of Life Notice - Chipcorder with Leaded Package - April 26, 2007
- End of Life Notice - Chipcorder with Leaded Package - Customer File - April 26, 2007
- End of Life Notice - W83687THF/ W83687THG - April 23, 2007 (PDF - 68Kb)
- End of Life Notice - W27/W29/W39V/W39L Series EPROM/Flash - April 4, 2007 (PDF - 95Kb)
- Advance PC (APC) EOL No. WECA070301 -Effective 03/23/2007 - April 2, 2007 (PDF - 116Kb)
- End of Life Notice - ISD4002-240 and ISD4003-04M with leaded TSOP and SOP packages - April 2, 2007 (PDF - 77Kb)
- End of Life Notice - Advanced PC (APC) 87382DG/K1 - January 19, 2007 (PDF - 93Kb)
- End of Life Notice-ISD2560/75/90/120 - January 17, 2007 (PDF - 78Kb)
- End of Life Notice - I4215P, I4306P, I4408ED, I4410X, I4412S, I4416E, I2560PI5016 and I2575SI5016 - January 10, 2007 (PDF - 96Kb)
- End of Life Notice - W83L785R/ W83L785G - January 9, 2007 (PDF - 67Kb)
- End of Life Notice - W83627F-AW/ W83627G-AW - January 9, 2007 (PDF - 68Kb)
- End of Life Notice - W83687THF/ W83687THG - January 9, 2007 (PDF - 68Kb)
- EOL Notice - I4215P, I4306P, I4408ED, I4410X, I4412S, I4416E - December 20, 2006 (PDF - 115Kb)
- EOL Notice - I2560PI5016 and I2575SI5016 - December 20, 2006 (PDF - 100Kb)
- End of Life Notice- W77/W78/W79 sereis in leaded package (uC) - September 14, 2006 (PDF - 43Kb)
- ISD I14xx & I25xx series End of Life Notice - August 25, 2006 (PDF - 156Kb)
- EOL Notice- W77/W78/W79 sereis in leaded package (uC) - August 8, 2006 (PDF - 100Kb)
- EOL Notice- ISD 12XX Series - May 3, 2006 (PDF - 73Kb)
- EOL notice- Amendment of Advanced PC (APC) parts - April 24, 2006 (PDF - 72Kb)
- Freescale EOL – Winbond Replacements - April 7, 2006 (PDF - 74Kb)
- W49F201L201 - July 19, 2004
- W29C0401 - July 19, 2004
- W29C020 - July 19, 2004
- W27CEL02 - July 19, 2004
- W27CE040 - July 19, 2004
- W27C4096 - July 19, 2004
- W49F102L102 - July 19, 2004
- Product Obsolescence Notice - W83627HF-AW
- Product Obsolescence Notice for W77E717FD
- Winbond PCN W741EXXX
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Electronic Components Distributor
All Rights Reserved
Reproduction in whole, or in part, without the written permission of the copyright holder is prohibited.
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