• PCN PA200711-03 - Add 2nd source of TSSOP 28L 4.4X9.7MM^2 assembly house - December 5, 2007 (PDF - 227Kb)
• PCN-W4200710-01B - Fab 4/5 ownership change - December 5, 2007 (PDF - 159Kb)
• PCN -- Change ISD device Al-bag & Humidity indicator card in T&R packing - November 19, 2007 (PDF - 278Kb)
• PCN-WF20070451 Ammended - 427 device Fab Transfer (from NSME to TSL) - Preliminary - November 21, 2007 (PDF - 45Kb)
• PCN-WF20070451 - 427 device Fab Transfer (from NSME to TSL) - Preliminary - November 15, 2007 (PDF - 38Kb)
• PCN-PA200711-01 - Change marking method from ink to laser for the products of LQFP48L/100L/128L - November 9, 2007 (PDF - 261Kb)
• PCN-PA200710-06C - Add an additional assembly site, Walton, for SOP 8L 208 mil package - November 9, 2007 (PDF - 173Kb)
• PCN-PA200710-05C - Add an additional assembly site, Walton, for SOP 8L 150mil package - November 9, 2007 (PDF - 174Kb)
• PCN-PA200710-07 - Add new supplier of LQFP128 (14x14x1.4mm^3) package (Post-PCN) - November 6, 2007 (PDF - 270Kb)
• PCN-PA200710-04 - Add new supplier of LQFP48 (7x7x1.4mm^3) package - October 22, 2007 (PDF - 271Kb)
• PCN 4309-0107 - SPIL site change from Taichung factory to Zhanghua factory - October 8, 2007 (PDF - 264Kb)
• PCN PA200709-01 - Add new source of QFN20L (4x4mm^2) assembly house - September 12, 2007 (PDF - 168Kb)
• PCN-PA200708-02 - Add new source of QFN20 4*4mm^2 assembly house for Winbond lead free products - August 13, 2007 (PDF - 164Kb)
• PCN for backside marking removal (SSOP48_300MIL) - July 20, 2007 (PDF - 227Kb)
• PCN for QFP 128L (14x20x2.75 MM^3 products) gold wire diameter change - July 19, 2007 (PDF - 145Kb)
• PCN PA200706-02 - Additional Assembly house for PQFP_128L(14x20 mm^2) package for Pb-free products - June 19, 2007 (PDF - 161Kb)
• PCN PA200705-09 - SPIL site change from Tai-Chung,Taiwan to Zhang-Hua,Taiwan - June 7, 2007 (PDF - 38Kb)
• PCN Advanced PC (APC) 427 device Fab transfer from NSME to TSL-Preliminary - June 7, 2007 (PDF - 38Kb)
• PCN PA200705-08 - Additional assembly house for PDIP_40L(600mil) package for Pb-free products - May 24, 2007 (PDF - 171Kb)
• PCN PA200703-03 - New Assembly House for SOP 20L (300MIL) Package - April 5, 2007 (PDF - 146Kb)
• PCN - Change of the gold wire diameter from 1.0 mil to 0.9 mil for SSOP 48L (300 MIL Products) - April 4, 2007 (PDF - 163Kb)
• PA20070201 - PLCC44 (653x653 MIL^2 products) Gold Wire Diameter Change - February 23, 2007 (PDF - 143Kb)
• PCN - New source of QFP44 (10x10mm^2) package assembly house for Pb-free products - February 8, 2007 (PDF - 174Kb)
• PCN - upgrade molding compounds of LQFP family series at Greatek - January 24, 2007 (PDF - 260Kb)
• PCN for topside marking change from ink to laser for QFP44_10x10mm^2- January 23, 2007 (PDF - 140Kb)
• PCN Z200-PCN-PA2000611-02 - Additional Assembly Site- Greatek -- SOP 8L (150 mil) lead-free Serial Flash - December 4, 2006 (PDF - 1Mb)
• PCN Z200-PCN-PA20060903- top side mark change from ink to laser for PDIP 18L & PDIP 20L_300mil products - September 27, 2006 (PDF - 397Kb)
• Part Number Change of Advanced PC (APC) products-Reminder - August 25, 2006 (PDF - 95Kb)
  • Advanced PC (APC) EOL Products - August 25, 2006 (PDF - 215Kb)
• PA20060503 - Add New Site for PDIP28-600 mil package - August 2, 2006 (PDF - 255Kb)
• Standard Outer Box Label Change Letter - June 28, 2006 (PDF - 437Kb)
• PCN Notification-backend transition of Advanced PC (APC) products - June 16, 2006 (PDF - 422Kb)
• PCN for new source of QFP 128L 14x20mm² lead free parts - June 15, 2006 (PDF - 139Kb)
• Part Number Change of Advanced PC (APC) Products - June 1, 2006 (PDF - 61kb)
• PCN PA20060402 CMOS9 PQFP128 leadfree - May 3, 2006 (PDF - 480Kb)
• PCN PA20060403 CMOS9 LQFP100 39X - May 3, 2006 (PDF - 698Kb)
• PCN PA20060404 CMOS9 PQFP128 std - May 3, 2006 (PDF - 412Kb)
• PCN PA20060405 CMOS7 PQFP128 leadfree - May 3, 2006 (PDF - 509Kb)
• PCN PA20060406 CMOS9 LQFP48-381-382 - May 3, 2006 (PDF - 592Kb)
• PCN PA20060407 CMOS9 TQFP64 383 384 - May 3, 2006 (PDF - 874Kb)
• PCN Notification-Add an Additional Assembly Site, SPIL, for VFBGA 60B package - April 27, 2006
  • PCN-PA200604-01 (PDF - 134Kb)
  • Attachment I VFBGA60 dim BOM (PDF - 121Kb)
  • Attachment II VFBGA 60LPb free Qual report (SPIL) (PDF - 421Kb)
• PCN PA20060101 PC87366 ICK - January 17, 2006 (DOC - 554Kb)
• PCN PA20060104 PC87364 IBW - January 17, 2006 (DOC - 555Kb)

Current Product Change Notices

Previous Product Change Notices 2003 - 2005