This new platform, designed specifically for ASIC prototyping by the Tokyo Electron Device engineering team, features the largest FPGA currently available from Xilinx. In addition, the board is populated with the faster -2 devices in the 1760 FF1760 package. For prototyping needs that require more than one FPGA, this board is designed to be stacked together.

Key Features:

• XC5VLX330-2FFG1760 Platform FPGA from Xilinx
• 512 Mbit DDR2 SDRAM x4
• 128 Mbit DDR SDRAM
• DVI Tx/Rx (UXGA)
• 10/100/1G Ethernet Phy
• High-speed Expansion connector (120 pin) x4
• 50 I/O Pin Header x2